🧬 Materials Science · SMP Design

SMP Formulation Designer

Interactive Tg and modulus tuning for thermoset shape-memory polymers. Dial in crosslink density, monomer ratio, and chain extender to target independent Tg and rubbery modulus for DragonSuit rib fabrication, neural probe substrates, and wearable electronics applications.

Physics based on thiol-ene/acrylate SMP literature · Voit et al. · Mnemosynation process parameters · Tg 25–75°C envelope

Chemistry System
Base System
Cure Method
Formulation Parameters
Crosslink Density (mol%) 35%
Hard Segment Ratio 0.42
Chain Extender (wt%) 18%
Monomer MW (g/mol) 420
Thiol:Ene Ratio 1.0
Environmental Conditions
Operating Temp (°C) 37°C
Humidity (%RH) 65%
Cycling Frequency (Hz) 0.5
Target Application
Application
Thickness (μm)
—
Tg (°C)
—
Glassy E (GPa)
—
Rubbery E (MPa)
—
Shape Recovery %
—
Switch Width (°C)
—
Cycle Life (est.)
Fox Equation — Tg Prediction
1/Tg_blend = Σ(wᵢ / Tg_i) · Tg offset = f(crosslink density, MW, thiol:ene ratio)
E_glassy ≈ E₀ · exp(−α·(T − Tg)) · E_rubbery = 3nRT (rubber elasticity theory)
Recovery % = f(Rf × Rr) · Rf = fixity ratio · Rr = recovery ratio
Storage Modulus vs. Temperature (DMA Curve)
Shape Memory Cycle — Strain vs. Temperature
Application Target Assessment
RequirementTargetPredictedVerdict
Compatible Applications
Research Note (Voit et al.): Thiol-ene/acrylate systems offer independent Tg and modulus tuning by separating the crosslink network (controls modulus) from the soft segment length (controls Tg). At 1:1 thiol:ene ratio and 35% crosslink density, this system achieves Tg ≈ 38–42°C with rubbery modulus 1–3 MPa — the target envelope for DragonSuit rib deployment at body temperature.