⚡ Materials Science · Flexible Electronics

Stiffness Gradient Designer

Model spatially-graded stiffness transitions across multi-layer polymer substrates — from rigid electronic device interface to compliant biological tissue contact. Calculates delamination risk, peak interfacial strain, and mechanical mismatch index for wearable electronics, neural interfaces, and adaptive wearable systems.

Based on Voit et al. SMP softening substrate research · Stiffness gradient patent (USPTO 12096553) · Thiol-ene/acrylate bioelectronics literature

Device Architecture
Application
Rigid Component Modulus (GPa) 70
Target Tissue/Surface Modulus (kPa) 3
SMP Substrate Layer
Glassy Modulus (GPa) 1.8
Rubbery Modulus (MPa) 6
SMP Layer Thickness (μm) 100
Gradient Exponent (n) 2.0
Additional Layers
Elastomer Interlayer (MPa) 0.5
Elastomer Thickness (μm) 50
Device Overhang (μm) 0
Loading Conditions
Applied Strain (%) 15
Temperature (°C) 37
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Mismatch Index
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Peak Interface Strain
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Delamination Risk
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Stiffness Ratio
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Inflammatory Risk
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Gradient Layers
Stiffness Profile Through Layer Stack (Log Scale)
Interfacial Strain Distribution Under Applied Load
Layer Stack Assessment
Layer
Modulus Range
Thickness
Status
Failure Analysis
Failure ModeThresholdPredictedRisk
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